Die to wafer direct bonding of (100) single-crystal diamond thin films for quantum optoelectronics
arXiv QuantumArchived Mar 19, 2026✓ Full text saved
arXiv:2603.17140v1 Announce Type: new Abstract: This work unlocks the manufacturing of nanophotonic quantum systems that exploit the unique material properties of single-crystal diamond (SCD). We achieve this by introducing a semiconductor-compatible process for the direct bonding of multiple high-quality, ultrathin diamond films onto a carrier wafer, enabling the subsequent parallel nanofabrication of optoelectronic integrated circuits. Central to this approach is a new diamond surface-preparat
Full text archived locally
✦ AI Summary· Claude Sonnet
Quantum Physics
[Submitted on 17 Mar 2026]
Die to wafer direct bonding of (100) single-crystal diamond thin films for quantum optoelectronics
Dominic Lepage, Amin Yaghoobi, Heidi Tremblay, Dominique Drouin
This work unlocks the manufacturing of nanophotonic quantum systems that exploit the unique material properties of single-crystal diamond (SCD). We achieve this by introducing a semiconductor-compatible process for the direct bonding of multiple high-quality, ultrathin diamond films onto a carrier wafer, enabling the subsequent parallel nanofabrication of optoelectronic integrated circuits. Central to this approach is a new diamond surface-preparation method that avoids boiling tri-acid mixtures while producing exceptionally clean 20 um thin single crystals. These platelets are bonded side-by-side to 100 mm silica wafers and exhibit a record shear strength of 45.1 MPa for (100)-oriented diamond, surpassing all previously reported bonding attempts. Evidence indicates that the bonding is dominated by van der Waals interactions, likely arising from mismatched protonation mechanisms between Si-OH and C-OH surface terminations, rather than from covalent-bond-driven mechanisms. Despite this non-molecular nature, the heterostructures remain stable through liquid immersions and standard nanofabrication steps. Because the method depends primarily on surface cleanliness and roughness rather than specific chemistries, it is broadly transferable across wafer materials. This capability to parallel-bond ultrathin SCD films onto large-area substrates provides a scalable route to high-performance platforms spanning nanophotonic quantum technologies, high-power electronics, MEMS, and biotechnology.
Subjects: Quantum Physics (quant-ph); Materials Science (cond-mat.mtrl-sci); Applied Physics (physics.app-ph)
Cite as: arXiv:2603.17140 [quant-ph]
(or arXiv:2603.17140v1 [quant-ph] for this version)
https://doi.org/10.48550/arXiv.2603.17140
Focus to learn more
Submission history
From: Dominic Lepage [view email]
[v1] Tue, 17 Mar 2026 21:12:02 UTC (770 KB)
Access Paper:
view license
Current browse context:
quant-ph
< prev | next >
new | recent | 2026-03
Change to browse by:
cond-mat
cond-mat.mtrl-sci
physics
physics.app-ph
References & Citations
INSPIRE HEP
NASA ADS
Google Scholar
Semantic Scholar
Export BibTeX Citation
Bookmark
Bibliographic Tools
Bibliographic and Citation Tools
Bibliographic Explorer Toggle
Bibliographic Explorer (What is the Explorer?)
Connected Papers Toggle
Connected Papers (What is Connected Papers?)
Litmaps Toggle
Litmaps (What is Litmaps?)
scite.ai Toggle
scite Smart Citations (What are Smart Citations?)
Code, Data, Media
Demos
Related Papers
About arXivLabs
Which authors of this paper are endorsers? | Disable MathJax (What is MathJax?)