The hidden digital divide in packaging machinery: Cybersecurity may become the industry’s next challenge - Omdia
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The hidden digital divide in packaging machinery: Cybersecurity may become the industry’s next challenge Omdia
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The Analyst Team
Rachel See
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Senior Analyst, Manufacturing Technology
Rachel conducts research and analysis on the machinery market. Previously, she conducted primary research with manufacturers and secondary research on topics related to low-voltage drives in discrete and process industries for Omdia's Low Voltage Drives Intelligence Service. She is an analyst for Omdia’s Machinery Production Market Tracker (MPMT).
Rachel joined Omdia in 2022. Previously, Rachel was based in a manufacturing company for over four years where she gained plenty of hands-on experience. There, she worked as a project engineer, handling improvement, cost saving, and expansion projects. Rachel graduated with a Bachelor of Science in mechanical engineering at the Karlsruhe Institute of Technology in Germany.
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Rachel See
Anna Ahrens
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Principal Analyst
As a member of the Industrial IoT, software & communications team, Anna focuses on Industrial IoT. She examines the state of IIoT maturity and trends and transformations in automation approaches, edge and cloud computing, AI, cybersecurity, and predictive maintenance.
Anna joined Omdia in January 2019 and has more than 10 years of experience in the electronic components industry. Her background includes roles in forecasting, market intelligence, business development, and product management for display devices. Anna is based in Frankfurt am Main, Germany.
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Manufacturing Technology
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