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Microchip Secures IEC 62443-4-1 ML2 Certification, Strengthening Industrial Cybersecurity - Embedded Computing Design

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Microchip Secures IEC 62443-4-1 ML2 Certification, Strengthening Industrial Cybersecurity Embedded Computing Design

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    Microchip Secures IEC 62443-4-1 ML2 Certification, Strengthening Industrial Cybersecurity By Chad Cox PRODUCTION EDITOR EMBEDDED COMPUTING DESIGN April 10, 2026 NEWS Image Credit: Microchip Technology Microchip Technology released information that it is now certified by UL Solutions to the IEC 62443‑4‑1 Maturity Level 2 (ML2) Industrial Automation and Control System standard. The achievement highlights the fact that Microchip’s product development process meets globally recognized secure by design criteria. The audit-backed certification process offers customers confidence in Microchip’s products being designed under a proven, repeatable, and independently verified cybersecurity framework. Microchip integrates security into hardware and software from the beginning phases of design through deployment for emerging regulatory requirements such as the EU Cyber Resilience Act (CRA). “Achieving IEC 62443‑4‑1 ML2 certification reflects Microchip’s long‑standing commitment to rigorous security practices,” said Nuri Dagdeviren, corporate vice president of Microchip Technology’s secure computing group. “Customers need partners who can demonstrate secure development maturity, not simply claim it. This independently validated certification strengthens trust, reduces risk across the hardware–firmware stack and supports our customers as they work toward CRA and other standards‑based compliance.” For more information on Microchip’s IEC 62443‑4‑1 ML2 certification and cybersecurity offerings, visit Cyber Resilience Act (CRA) Compliance. SUBSCRIBE Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature. More from Chad Categories SECURITY - IEC 61508/60601, ISO 26262 & OTHER STANDARDS SECURITY TRENDING ARTICLES DFI: Mission-Critical Embedded Computing for Edge AI-Driven Industrial Environments April 06, 2026 7STARLAKE Releases THOR11-H6/X6 1U Servers with Intel Xeon D for AI and Defense Edge April 06, 2026 Mouser Product of the Week: Analog Devices’ ADPA1112-EVALZ Evaluation Board April 06, 2026 Edge AI Solutions, The Memory Crisis, and Sustainable AI April 02, 2026 Sapphire Technology at embedded world 2026 April 01, 2026 AI & MACHINE LEARNING Scale-Up & Scale Out: Addressing the Demands of Modern AI Networks April 9, 2026 embedded world 2026 Podcast with Axelera AI March 25, 2026 Kontron KBox A‑151 EAI Now Powered by SiMa.ai Physical AI for Industrial Edge March 20, 2026 2026 embedded world: “Build Once, Scale Anywhere” Keynote by Microchip COO, Rich Simoncic March 19, 2026 Advantech to Demonstrate Robotics, Healthcare, and Retail Edge AI at NVIDIA GTC 2026 March 18, 2026 MORE AUTOMOTIVE ISO 8800 Is Coming to Your Next Platform Program — Are You Ready? March 30, 2026 eSOL and Quintauris Partner to Expand Software Integration in RISC-V Automotive Platforms March 23, 2026 How BASE-AU Enables High-Speed Optical Camera Links in Next-Generation Vehicles March 05, 2026 From Design to Verification: Best Practices for Automotive Functional Safety Certification February 05, 2026 Auto Audio Gets Upgrade with Cadence Tensilica February 05, 2026 MORE OPEN SOURCE Innatera Unveils Synfire: Community-Driven Platform Tackling Neuromorphic Ecosystem Fragmentation April 8, 2026 Axiomtek AIE015-AT Kit Powered by NVIDIA Jetson Thor Targets Robotics April 07, 2026 BeagleBoard.org Launches BeagleBadge at embedded world Germany March 10, 2026 embedded world Germany 2026 Dev Kit Zone March 06, 2026 Trends in Embedded: LVGL Innovation & A Countdown to embedded world 2026 March 05, 2026 MORE HPC/DATACENTERS Embedded Executive: Dealing With the Massive Power Draw in Data Centers | Infineon March 25, 2026 PSM Integration for Enhanced Module Solutions in 48 V Data Centers March 04, 2026 BCM Teams Up with Intel for 2U Rackmount Edge AI Workstation March 04, 2026 Menlo Micro and Purdue University Announces Commercial-Ready Architecture for Scalable Quantum Computing at Cryogenic Temperatures March 03, 2026 Accenture to Purchase 65% of DLB, Boosting AI Data Center Engineering and Consulting December 17, 2025 MORE
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    Apr 10, 2026
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